d a t a sh eet product data sheet supersedes data of 2003 may 21 2003 jun 03 discrete semiconductors PMEG2015EV low v f mega schottky barrier diode m3d74 4
2003 jun 03 2 nxp semiconductors product data sheet low v f mega schottky barrier diode PMEG2015EV features ? forward current: 1.5 a ? reverse voltage: 20 v ? very low forward voltage ? ultra small plastic smd package ? flat leads: excellent coplanarity and improved thermal behaviour. applications ? low voltage rectification ? high efficiency dc-dc conversion ? switch mode power supply ? inverse polarity protection ? low power consumption applications. description planar maximum efficiency general application (mega) schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a sot666 ultra small smd plastic package. pinning pin description 1 cathode 2 cathode 3 anode 4 anode 5 cathode 6 cathode handbook, halfpage 123 4 5 6 1, 2 5, 6 3, 4 mhc310 fig.1 simplified outline (sot666 and symbol). marking code: f5. limiting values in accordance with the absolute maximum rating system (iec 60134). note 1. only valid if pins 3 and 4 are connected in parallel. symbol parameter conditions min. max. unit v r continuous reverse voltage ? 20 v i f continuous forward current t s < 55 c ? 1.5 a i fsm non-repetitive peak forward current t p = 8 ms square wave; note 1 ? 10 a i frm repetitive peak forward current t p = 1 ms; = 0.25 ? 4.5 a t stg storage temperature ? 65 +150 c t j junction temperature ? 150 c t amb operating ambient temperature ? 65 +125 c
2003 jun 03 3 nxp semico nductors product data sheet low v f mega schottky barrier diode PMEG2015EV electrical characteristics t amb = 25 c unless otherwise specified. notes 1. only valid if pins 1, 2 and 5, 6 are soldered on 1 cm 2 copper solder land. 2. pulse test: t p = 300 s; = 0.02. thermal characteristics notes 1. refer to sot666 standard mounting conditions. 2. device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for cathode 1 cm 2 . 3. soldering point of cathode tabs. soldering reflow soldering is the only recommended soldering method. symbol parameter conditions typ. max. unit v f continuous forward voltage see fig.2; note 1 i f = 10 ma 240 270 mv i f = 100 ma 300 350 mv i f = 1 000 ma 480 550 mv i f = 1 500 ma 530 660 mv i r continuous reverse current see fig.3; note 2 v r = 5 v 5 10 a v r = 8 v 7 20 a v r = 15 v 10 50 a c d diode capacitance v r = 5 v; f = 1 mhz; see fig.4 19 25 pf symbol parameter conditions value unit r th j-a thermal resistance from junction to ambient note 1 405 k/w note 2 215 k/w r th j-s thermal resistance from ju nction to solder point note 3 80 k/w
2003 jun 03 4 nxp semico nductors product data sheet low v f mega schottky barrier diode PMEG2015EV graphical data handbook, halfpage 0.6 0.4 0.2 0 i f (ma) v f (v) 10 4 10 3 10 2 10 1 10 ? 1 mle111 (1) (3) (2) fig.2 forward current as a function of forward voltage; typical values. (1) t amb = 125 c. (2) t amb = 85 c. (3) t amb = 25 c. handbook, halfpage 25 0 51015 i r ( a) 20 v r (v) 10 5 10 4 10 3 10 2 10 1 mhc312 (1) (2) (3) fig.3 reverse current as a function of reverse voltage; typical values. (1) t amb = 125 c. (2) t amb = 85 c. (3) t amb = 25 c. handbook, halfpage 05 c d (pf) 10 20 80 60 20 0 40 15 v r (v) mhc313 fig.4 diode capacitance as a function of reverse voltage; typical values. f = 1 mhz; t amb = 25 c.
2003 jun 03 5 nxp semico nductors product data sheet low v f mega schottky barrier diode PMEG2015EV package outline unit b p cd e e 1 h e l p w references outline version european projection issue date 01-01-04 01-08-27 iec jedec eiaj mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 dimensions (mm are the original dimensions) 0.3 0.1 sot666 b p pin 1 index d e 1 e a l p detail x h e e a s 0 1 2 mm scale a 0.6 0.5 c x 123 4 5 6 plastic surface mounted package; 6 leads sot66 6 ys w m a
2003 jun 03 6 nxp semico nductors product data sheet low v f mega schottky barrier diode PMEG2015EV data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers general ? information in this docu ment is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shal l have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, airc raft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that su ch applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. expo sure to limiting values for extended periods may af fect device reliability. terms and conditions of sale ? nxp semico nductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile /terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in th is document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
nxp semiconductors contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2009 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors. no changes were made to the content, except for the legal definitions and disclaimers. printed in the netherlands 613514/02/pp7 date of release: 2003 jun 03 document order number: 9397 750 11556
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